Yamashita Materials Corporation has established the reliability test for print circuit utilizing the know-how of printed board production in long term and provides it as a service.

Creation of sample board, test and evaluation can be supported.
Please relegate the reliability test for print circuit to professional of board!

Environmental test Temperature and humidity cycle test Constant temperature and humidity test Thermal shock test Migration test Solder heat resistance test Chemical proof test	Mechanical test Conductor peal-off strength test Through-hole peal-off strength test Solder mask bond test Gold plating bond test Folding resistance test (FPC only) Flex resistance test (FPC only) Mounted parts peal-off strength test Cross section observance (micro section)
Electric test Insulation resistance (surface layer) test Test of withstand voltage on surface Minute resistance value measurement	Various measurements Fluorescent X-ray film thickness measurement Two-dimensional length measurement Microscope observance Electronic balance measurement

Digital microscope BGA observance by KH-3000	Cross section observance / flex rigid board

	[Supported test item] · Solder heat resistance test · Chemical resistance test		[Supported test item] · Insulation resistance test · Withstand voltage test · Temperature and humidity cycle test · Constant temperature and humidity test · Conductor peal-off strength test · Coverlay embeddedness test · Folding resistance test · Flex resistance test
	[Supported test item] · Thermal shock test

*	We prepare gerber data for various test patterns. When you request for creation of test sample board, please contact our sales representative.

If you have any inquiry on specifications etc., please contact our sales department. For inquiry or estimation, contact us by telephone, FAX or Email.
Yamashita Materials Corporation CIRCUITEC company, sales department
TEL: +81-46-251-3722
FAX: +81-46-251-3725