Technical Catalog Download – Useful Technical Information on FPCs
No. | Title | Features | Catalog |
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0 | About Yamashita MaterialS |
English About Yamashita MaterialS 1 file(s) 1.97 MB
Chinese About Yamashita Materials_ch 1 file(s) 2.01 MB
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1 | 4 layer Filld Blind Via FPC | Multilayer FPCs that enable high-density wiring while achieving small size, light weight, and thinness, using filled plating for blind vias.
English 4 layer Filld Blind Via FPC 1 file(s) 1 MB
Chinese 4 layer Filld Blind Via FPC_ch 1 file(s) 1.29 MB
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2 | YFC LVDS type Coplanar (RFC) | RFC(Radio Frequency Coplanar cable) Multilayer FPCs that enable high-density wiring while achieving small size, light weight, and thinness, using filled plating for blind vias. The base film is made of liquid crystal polymer (LCP) to reduce transmission loss. English YFC LVDS type Coplanar (RFC) 1 file(s) 1.39 MB
Chinese YFC LVDS type Coplanar (RFC)_ ch 1 file(s) 1.38 MB
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3 | YFC Shielded type (SFC) | SFC is a shielding film applied to our YFC and is indispensable in situations where EMC countermeasures are required.
English YFC Shielded type (SFC) 1 file(s) 1.47 MB
Chinese YFC Shielded type (SFC)_ ch 1 file(s) 1.45 MB
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4 | YFC LVDS type Stripline (RFS) | RFS(Radio Frequency Stripline cable) Like RFC, RFS uses liquid crystal polymer (LCP) as the base film. It also uses a shielding film, making it ideal for use when EMC countermeasures are required. English YFC LVDS type Stripline (RFS) 1 file(s) 1.41 MB
Chinese YFC LVDS type Stripline (RFS)_ch 1 file(s) 1.45 MB
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5 | YFC Normal type | A flexible flat cable that replaces FFC. It can be manufactured at a lower cost than standard FPCs because it can be ordered only in the quantity required by the customer, enabling inventory-less production and initial-less production.
English YFC Normal type 1 file(s) 1.24 MB
Chinese YFC Normal type_ch 1 file(s) 1.21 MB
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6 | YFC LVDS type Microstrip line (RFM) | RFM(Radio Frequency Microstripline cable) Liquid crystal polymer (LCP) is used for the base film to reduce transmission loss. The type that uses liquid crystal polymer (LCP) film for insulation can further reduce transmission loss. English YFC LVDS type Microstrip line (RFM) 1 file(s) 1.62 MB
Chinese YFC LVDS type Microstrip line (RFM)_ch 1 file(s) 1.63 MB
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7 | YFC convex-concave terminal type | “Unevenness that serves as a locking mechanism is formed on the terminals according to the specifications of the connector. The total length of the cable can be made according to the specified length (maximum 420 mm), number of cores, and pitch.” English YFC convex-concave terminal type 1 file(s) 1.93 MB
Chinese YFC convex-concave terminal type_ch 1 file(s) 1.91 MB
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8 | High temperature durability Oil resistant FPC | “All LCP substrate. *¹Cleared UL standard (796F) flexibility test (AB test) equivalent to MOT180℃.” English High temperature durability Oil resistant FPC 1 file(s) 1.50 MB
Chinese High temperature durability Oil resistant FPC_ch 1 file(s) 1.52 MB
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9 | Long-term high-temperature durability FPC | “All LCP substrate. Meets JIS C 5016 insulation resistance, conduction resistance change rate, and withstand voltage after long-term high temperature test at 200°C for 1000 hours.” English Long-term high-temperature durability FPC 1 file(s) 1.36 MB
Chinese Long-term high-temperature durability FPC_ch 1 file(s) 1.37 MB
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10 | FPC for High-speed transmission Connector | This product is a combination of Iriso Electronics’ high-speed transmission connector and our YFC Series RFM.
English FPC for High-speed transmission Connector 1 file(s) 1.57 MB
Chinese FPC for High-speed transmission Connector_ch 1 file(s) 1.60 MB
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11 | Multilayer FPC for High-speed transmission | Integration of FPC and rigid substrate reduces the number of reflection points. High-density RF lines are possible compared to rigid substrates. Wire bonding is also supported, and a metal or ceramic reinforcement plate can be attached as a heat dissipation measure.
English Multilayer FPC for High-speed transmission 1 file(s) 1.65 MB
Chinese Multilayer FPC for High-speed transmission_ch 1 file(s) 1.63 MB
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12 | High heat dissipation FPC | FPC using Okitsumo’s heat-resistant solder resist “Tainex”.
English High heat dissipation FPC 1 file(s) 1.68 MB
Chinese High heat dissipation FPC_ch 1 file(s) 1.63 MB
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13 | High density Multilayer FPC | Although it has a 12-layer structure, the thickness of the board is less than 1mm, and the cable part can be bent.
English High density Multilayer FPC 1 file(s) 1.50 MB
Chinese High density Multilayer FPC_ch 1 file(s) 4.00 KB
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14 | Multilayer coil FPC | With a conductor thickness of 75μm to 90μm, it is capable of carrying a larger current than ordinary FPCs.
English Multilayer coil FPC 1 file(s) 2.15 MB
Chinese Multilayer coil FPC_ch 1 file(s) 2.16 MB
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15 | High Current FPC | FPCs for high-current wiring intended to replace bus bars and harnesses.
English High Current FPC 1 file(s) 1.89 MB
Chinese High Current FPC_ch 1 file(s) 1.46 MB
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16 | Ultra-small diameter through hole | Formation of ultra-small Via of φ20μm on double-sided FPC by laser processing. Minimum hole diameter of 20μm and minimum land diameter of 95μm can be formed.
English Ultra-small diameter through hole 1 file(s) 1.25 MB
Chinese Ultra-small diameter through hole_ch 1 file(s) 1.25 MB
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17 | Slit FPC | FPC with slit processing that enables twisting and torsion; used as a substitute for thin coaxial cables, wire harnesses, and cables for medical equipment.
English Chinese Slit FPC_ch 1 file(s) 1.59 MB
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18 | Long-length FPC | Realizes meter-class long-distance wiring with ultra-thin cables of 1 mm or less.
English Long-length FPC 1 file(s) 1.55 MB
Chinese Long-length FPC_ch 1 file(s) 1.60 MB
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19 | ACF connection | ACF is a mounting technology that does not use solder, and is mainly used for FOG (Film On Glass) that connects FPC to LCD. By changing the connector connection to ACF mounting, lightweight, ultra-thin, and fine pitch connections are possible, enabling lighter, smaller, and thinner packaging for electronic devices.
English ACF connection 1 file(s) 1.69 MB
Chinese ACF connection_ch 1 file(s) 1.74 MB
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20 | Low spring-back High-speed transmission FPC | A stripline FPC with a shielding material for noise suppression, which is approximately 200 μm thinner than a conventional 3-layer FPC and reduces the repulsive force to about 1/3.
English Low spring-back High-speed transmission FPC 1 file(s) 1.57 MB
Chinese Low spring-back High-speed transmission FPC_ch 1 file(s) 1.63 MB
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21 | Metal base Heat dissipation substrate | Metal base Heat dissipation substrate becomes a substrate with improved heat dissipation through thermal conduction, reducing thermal problems.
English Metal base Heat dissipation substrate 1 file(s) 1.31 MB
Chinese Metal base Heat dissipation substrate_ch 1 file(s) 1.33 MB
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22 | Separated multi-layer FPC for card edge connector | Multilayer FPCs compatible with card edge connectors. 4 to 6 layers of multilayer FPCs can be mated with card edge connectors on both sides, forming stable impedance lines. It can be used for mounting of packaged components such as BGAs, mounting of bare chips on FPCs, and connection by wire bonding.
English Separated multi-layer FPC for card edge connector 1 file(s) 1.71 MB
Chinese Separated multi-layer FPC for card edge connector_ch 1 file(s) 2.10 MB
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23 | Low-loss FPC (GHz band Microstrip line) | PTFE-based + low-dielectric coverlay, PTFE-based + soft resist, transmission loss improved by 60-70% compared to normal products in 40GHz band. Transmission loss of LCP base + low dielectric coverlay, which is easy to handle, is improved by about 50%.
English Low-loss FPC (GHz band Microstrip line) 1 file(s) 1.36 MB
Chinese Low-loss FPC (GHz band Microstrip line)_ch 1 file(s) 1.46 MB
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24 | Ground slit MSL | It utilizes a technology currently under development that enables thinner FPCs while maintaining transmission characteristics.
English Ground slit MSL 1 file(s) 1.35 MB
Chinese Ground slit MSL_ch 1 file(s) 1.41 MB
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25 | Ultrafine Circuit High Frequency FPC | It enables high-density, high-precision patterning using the semi-additive method on a liquid crystal polymer film substrate.
English Ultrafine Circuit High Frequency FPC 1 file(s) 1.93 MB
Chinese Ultrafine Circuit High Frequency FPC_ch 1 file(s) 1.69 MB
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26 | High-density・Flexible Button Plating | Since no plating is applied except for through-holes and non-through vias, the pattern width and thickness are highly accurate, and impedance control and stable high-frequency transmission characteristics can be expected.
English High-density・Flexible Button Plating 1 file(s) 1.61 MB
Chinese High-density・Flexible Button Plating_ch 1 file(s) 1.72 MB
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27 | High Current FPC (with Signal Line) | Save space with integrated High current wiring and signal line!
English High Current FPC (with Signal Line) 1 file(s) 1.62 MB
Chinese High Current FPC (with Signal Line)_ch 1 file(s) 1.64 MB
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28 | High Current FPC (Standard Products) | High current wiring enables flexible use!
English High Current FPC (Standard Products) 1 file(s) 2.13 MB
Chinese High Current FPC (Standard Products)_ch 1 file(s) 1.93 MB
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